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Events for April 02, 2015
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Trustworthy Integrated Circuit Design
Thu, Apr 02, 2015 @ 10:00 AM - 11:30 PM
Ming Hsieh Department of Electrical and Computer Engineering
Conferences, Lectures, & Seminars
Speaker: Jeyavijayan (JV) Rajendran, New York University
Talk Title: Trustworthy Integrated Circuit Design
Abstract: Designers use third-party intellectual property (IP) cores and outsource various steps in their integrated circuit (IC) design and manufacturing flow. As a result, security vulnerabilities have been emerging, forcing IC designers and end users to reevaluate their trust in ICs. If an attacker gets hold of an unprotected IC, attacks such as reverse engineering the IC and piracy are possible. Similarly, if an attacker gets hold of an unprotected design, insertion of malicious circuits in the design, and IP piracy are possible.â¨To thwart these and similar attacks, we have developed three defenses: IC camouflaging, logic encryption, and split manufacturing. IC camouflaging modifies the layout of certain gates in the IC to deceive attackers into obtaining an incorrect netlist, thereby, preventing reverse engineering by a malicious user. Logic encryption implements a built-in locking mechanism on ICs to prevent reverse engineering and IP piracy by a malicious foundry and user. Split manufacturing splits the layout and manufactures different metal layers in two separate foundries to prevent reverse engineering and piracy by a malicious foundry. We then describe how these techniques are enhanced by using existing IC testing principles, thereby leading to trustworthy ICs.
Biography: Jeyavijayan (JV) Rajendran is a PhD Candidate in the Electrical and Computer Engineering Department at New York University. His research interests include hardware security and emerging technologies.
He has won three Student Paper Awards (ACM CCS 2013, IEEE DFTS 2013, IEEE VLSI Design 2012); four ACM Student Research Competition Awards (DAC 2012, ICCAD 2013, DAC 2014, and the Grand Finals 2013); Service Recognition Award from Intel; Third place at Kaspersky American Cup, 2011; and Myron M. Rosenthal Award for Best Academic Performance in M.S. from NYU, 2011.
He organizes the annual Embedded Security Challenge, a red-team/blue-team hardware security competition. He is a student member of IEEE and ACM.
Website: wp.nyu.edu/jv
Host: Peter Beerel, pabeerel@usc.edu, EEB 350, x04481
More Information: Rajendran Seminar Announcement.pdf
Location: Hughes Aircraft Electrical Engineering Center (EEB) - 248
Audiences: Everyone Is Invited
Contact: Gloria Halfacre
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EE-EP Seminar
Thu, Apr 02, 2015 @ 10:30 AM - 12:00 PM
Ming Hsieh Department of Electrical and Computer Engineering
Conferences, Lectures, & Seminars
Speaker: Mohamed Mohamed, University of Illinois at Urbana-Champaign
Talk Title: A Coupled Multiphysics Approach to Modeling Heating in Semiconductor Devices
Abstract: It is estimated that world energy consumption will increase by over 40% from 2012 to 2035. Meeting this energy demand while minimizing the proliferation of greenhouse gases and other toxins is one of societyâs key challenges. In recent years, thermal management has emerged as the ultimate bottleneck for improving the performance of consumer/commercial electronics. Controlling device temperature, as well as harnessing waste heat, is crucial to sustaining electronic devices with longer battery life and performance, in addition to potentially reducing our demand on power plants by efficiently using generated electricity. Without proper thermal management, inordinate power dissipation can potentially halt integrated circuit functionality.
For this reason, the development of state-of-the-art simulation models that self-consistently couple the electronic and phonon transport is essential in creating a cycle that pushes designs to have lower carbon footprints and creating environmentally conscious electronics that minimize waste. In this talk, I will highlight my work on electron and thermal transport and its relevance to nanoelectronic devices and materials. We will particularly address issues ranging from transport and modeling issues to power dissipation and energy harvesting. We will draw examples ranging from multi-gate FETs, SONOS memories, tunneling FETs and thermoelectric devices and suggest new directions for improving device efficiency through device and material engineering.
Biography: Mohamed Mohamed received the Ph.D. degree in electrical engineering from the University of Illinois at Urbana-Champaign, Urbana, IL, USA, in 2012. He served as a Research Scientist and Visiting Lecturer with the University of Illinois at Urbana-Champaign. His doctoral dissertation work was performed in the Computational Multiscale Nanostructures group directed by Professor Umberto Ravaioli and has demonstrated self-heating effects in nanoscale silicon MOSFETs through coupled electro-thermal Monte Carlo simulation. His current research interest is primarily on the theory, design, simulation and characterization of energy efficient devices, materials and circuits. He also has a great interest in cyber education and in exploring innovative ways to enhance learning, education, and research. He has developed numerous simulation tools suitable for both research and classroom use hosted on the nanoHUB. He is the recipient of the Ernest Reid Fellowship Award in Electrical Engineering, the Graduate College Dean Fellowship and was listed several times in the UIUC List of Teachers Ranked Excellent.
Host: EE-Electrophysics
Location: Hughes Aircraft Electrical Engineering Center (EEB) - 132
Audiences: Everyone Is Invited
Contact: Marilyn Poplawski
