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Events for March 22, 2019

  • Repeating EventMeet USC: Admission Presentation, Campus Tour, and Engineering Talk

    Fri, Mar 22, 2019

    Viterbi School of Engineering Undergraduate Admission

    Workshops & Infosessions

    This half day program is designed for prospective freshmen (HS juniors and younger) and family members. Meet USC includes an information session on the University and the Admission process, a student led walking tour of campus, and a meeting with us in the Viterbi School. During the engineering session we will discuss the curriculum, research opportunities, hands-on projects, entrepreneurial support programs, and other aspects of the engineering school. Meet USC is designed to answer all of your questions about USC, the application process, and financial aid.

    Reservations are required for Meet USC. This program occurs twice, once at 8:30 a.m. and again at 12:30 p.m.

    Please make sure to check availability and register online for the session you wish to attend. Also, remember to list an Engineering major as your "intended major" on the webform!


    Location: Ronald Tutor Campus Center (TCC) - USC Admission Office

    Audiences: Everyone Is Invited

    View All Dates

    Contact: Viterbi Admission

  • Individual Grammar Tutorials

    Fri, Mar 22, 2019 @ 10:30 AM - 12:00 PM

    Viterbi School of Engineering Student Affairs

    Workshops & Infosessions

    Viterbi graduate and undergraduate students are invited to sign up for individual grammar assistance from professors at the Engineering Writing Program. Sign up for one-on-one individual sessions here: http://bit.ly/grammaratUSC

    Questions? Email helenhch@usc.edu

    Location: Olin Hall of Engineering (OHE) - 106

    Audiences: Graduate and Undergraduate Students

    Contact: Helen Choi


    Fri, Mar 22, 2019 @ 01:00 PM - 01:50 PM

    USC Viterbi School of Engineering

    Conferences, Lectures, & Seminars

    Speaker: Mr. Steven Gitlin, Vice President of Corporate Strategy, AeroVironment

    Talk Title: Imagine the Impossible

    Host: EHP and Dr. Prata

    Location: Henry Salvatori Computer Science Center (SAL) - 101

    Audiences: Everyone Is Invited

    Contact: Amanda McCraven

  • Wei Kong Seminar, Friday, March 22nd at 2PM in EEB 248

    Fri, Mar 22, 2019 @ 02:00 PM - 03:30 PM

    Ming Hsieh Department of Electrical and Computer Engineering

    Conferences, Lectures, & Seminars

    Speaker: Wei Kong, MIT

    Talk Title: 2D/3D hybrid materials towards a multifunctional integration platform

    Abstract: Our society is entering the era of Internet of Things (IoT), which will be built upon a massive network of electronics. Though ever-increasing speed in modern electronics has been a salient metric of progress, other factors such as cost effectiveness, power consumption, biocompatibility, multifunctionality have become equally important. In general, mainstream electronic materials processing fails to fulfill this plurality of requirements.
    Additive stacking of two-dimensional (2D) materials is a promising solution due to its freedom in functional design and reduction of material redundancy. This talk will introduce a new discovery in extracting a monolayer from multi-layer 2D material stacks. Although counterintuitive, this method enables perfect 2D material stacking by providing uniform, monolayer, wafer scale 2D material building blocks for scalable electronic device fabrication.
    The speaker will further introduce the new concept of additive stacking of ultrathin three-dimensional (3D) materials, which has been a missing part to the concept of additive fabrication of electronic materials. The discovery of "remote epitaxy" enables the fabrication of free-standing ultrathin 3D materials as the building blocks for functional stacking. Leveraging the past 50 years of development in conventional 3D materials, 3D material stacking allows immense freedom in electronic design, enabling enhanced device performance and new device architectures.
    These two discoveries further allow the integration of 2D and 3D materials as a new research area, which will allow the discovery of new physical phenomena, and lead to the advancements in wearables, human/machine interface, renewable energy, integrated photonics and quantum computation.

    Biography: Wei Kong is a postdoc researcher at MIT, specializing in multifunctional integration of ultrathin film 2D and 3D materials, including graphene, hBN, TMDCs, and III-V, III-nitride and oxide compound semiconductors. His interests are in material innovation for human/machine interfaces, renewable energy, wearable electronics, integrated photonics and quantum computation. He obtained his B.S. in Physics from Sun Yat-Sen University, M.S. and PhD. in ECE from Duke University working with Prof. April Brown. He is currently a Shell Energy fellow at MIT, working with Prof. Jeehwan Kim in the Department of Mechanical Engineering, where he is also associated with Research Laboratory of Electronics (RLE). His works have been published in Nature, Science, Nature Materials, and Nature Electronics.

    Host: ECE-Electrophysics

    Location: Hughes Aircraft Electrical Engineering Center (EEB) - 248

    Audiences: Everyone Is Invited

    Contact: Marilyn Poplawski