Events Calendar

Design for Manufacturability and Reliability in Extreme CMOS Scaling and 3D-IC Integration

Speaker: David Z. Pan, The University of Texas at Austin

Talk Title: Design for Manufacturability and Reliability in Extreme CMOS Scaling and 3D-IC Integration

Abstract: In this talk, I will present some recent research results on design for manufacturability (DFM) and reliability (DFR) in extreme CMOS scaling and 3D-IC integration by my group (www.cerc.utexas.edu/utda). For extreme CMOS scaling beyond 20nm, I will present some recent works CAD for double/multiple patterning lithography and emerging e-beam lithography, as well as lithography hotspot detection using meta-classification. For 3D-ICs, through silicon vias (TSV) cause thermal-mechanical stress, electromigration, and reliability issues. I will discuss some key challenges and issues for reliable 3D-IC integration.

Biography: David Z. Pan is currently an Associate Professor at the Department of Electrical and Computer Engineering, University of Texas at Austin, where he directs the UT Design Automation (UTDA) Lab. He received his Ph.D. in computer science (with honor) from UCLA in 2000. He was a ResearchStaff Member at IBM T. J. Watson Research Center from 2000 to 2003. His research is mainly focused on design for manufacturing/reliability, nanometer physical design, intersection of physical and system-level co-design, and CAD for emerging technologies. He holds 8 U.S. patents and has published over 160 technical papers in premier journals and international conferences. He has served as an Associate Editor for IEEE Transactions on CAD, IEEE Transactions on VLSI, IEEE Transactions on CAS-I, IEEE Transactions on CAS-II, IEEE CAS Society Newsletter, and Journal of Computer Science and Technology. He has served as the IEEE CANDE Committee Chair, ACM/SIGDA Physical Design Technical Committee Chair, program/organizing committee member of major VLSI/CAD conferences, including ASPDAC (Track Chair), DAC (Track Chair), ICCAD (Track Chair), DATE, ISPD (Program/General Chair), ISCAS (CAD Track Chair), VLSI-DAT (EDA Chair), ISQED (Track Chair), ACISC (Program/General Chair), GLSVLSI (Publicity Chair), ISLPED (Design Tools Track Chair), SLIP (Publication Chair), among others. He is a member of the International Technology Roadmap for Semiconductor (ITRS) working group and has served in the Technical Advisory Board of Pyxis Technology Inc. (acquired by Mentor Graphics).

Host: Massoud Pedram

Location: Ronald Tutor Hall of Engineering (RTH) - 306

Audiences: Everyone Is Invited

Contact: Annie Yu