Events Calendar

CA DREAMS - Technical Seminar Series

Speaker: Subramanian Iyer, Professor, UCLA

Talk Title: Strategic Directions for Electronics Packaging

Series: CA DREAMS - Technical Seminar Series

Abstract: Recent advances in electronics packaging have come to the rescue as CMOS scaling has stalled making possible the incredible advances in AI/ML and many other fields, that promise to transform our lives. This journey, however, has only just begun and much more is yet to come. The key features that will drive this transformation can be described with the simple strategy of “scale-down and scale-out” that has characterized monolithic CMOS scaling for several decades, the drive to chiplets with higher yields, and the ability to assemble a diversity of technologies on the same substrate allowing us to blur the lines between monolithic chip and a large heterogeneous assembly of chips. In this talk we will describe our approach to simplify packaging at all levels: from design, architecture, process and manufacturing that have the potential to take packaging to the next level including the ability to scale packaging systematically. If time permits, we will outline how to meet those challenges through a broad and organic Industry-Academia Coalition called ÆPeX America – the Advanced Electronics Packaging eXchange for America. We will outline how companies (small and large), research establishments and Universities can join ÆPeX America and benefit and contribute to our progress.

Biography: Subramanian S. Iyer (Subu) is Distinguished Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Department and a joint appointment in the Materials Science and Engineering Department at the University of California at Los Angeles. In 2023-4, he was on assignment to the US Department of Commerce as Director of the National Advanced Packaging Manufacturing Program, where he laid the foundational strategy for the national packaging imperative. He is the founding Director of the Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS). Prior to that he was an IBM Fellow. His key technical contributions have been the development of the world’s first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm technology node used to make the first generation of truly low power portable devices as well as the first commercial interposer and 3D integrated products. Since joining UCLA, he has been exploring new packaging paradigms and device innovations that may enable wafer-scale architectures, in-memory analog compute and medical engineering applications.   He is a fellow of IEEE, APS, iMAPS and NAI as well as a Distinguished Lecturer of IEEE EDS and EPS. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for emerging technologies in 2012 and the 2020 iMAPS Daniel C. Hughes Jr Memorial award and the iMAPS distinguished educator award in 2021. Professor Iyer was also Professor Ramakrishna Rao Visiting Chair Professor at IISc, Bengaluru.

Host: Dr. Steve Crago

More Info: https://www.isi.edu/events/5776/strategic-directions-for-electronics-packaging/

Webcast: https://usc.zoom.us/j/97017422125?pwd=Dbrt8MNMrmBV3xalKQJcAiNsggFJjJ.1&from=addon

WebCast Link: https://usc.zoom.us/j/97017422125?pwd=Dbrt8MNMrmBV3xalKQJcAiNsggFJjJ.1&from=addon

Audiences: Everyone Is Invited

Contact: Amy Kasmir

Event Link: https://www.isi.edu/events/5776/strategic-directions-for-electronics-packaging/

This event is open to all eligible individuals. USC Viterbi operates all of its activities consistent with the University's Notice of Non-Discrimination. Eligibility is not determined based on race, sex, ethnicity, sexual orientation, or any other prohibited factor.

Add to Google Calendar