Wei Kong Seminar, Friday, March 22nd at 2PM in EEB 248
Fri, Mar 22, 2019 @ 02:00 PM - 03:30 PM
Ming Hsieh Department of Electrical and Computer Engineering
Conferences, Lectures, & Seminars
Speaker: Wei Kong, MIT
Talk Title: 2D/3D hybrid materials towards a multifunctional integration platform
Abstract: Our society is entering the era of Internet of Things (IoT), which will be built upon a massive network of electronics. Though ever-increasing speed in modern electronics has been a salient metric of progress, other factors such as cost effectiveness, power consumption, biocompatibility, multifunctionality have become equally important. In general, mainstream electronic materials processing fails to fulfill this plurality of requirements.
Additive stacking of two-dimensional (2D) materials is a promising solution due to its freedom in functional design and reduction of material redundancy. This talk will introduce a new discovery in extracting a monolayer from multi-layer 2D material stacks. Although counterintuitive, this method enables perfect 2D material stacking by providing uniform, monolayer, wafer scale 2D material building blocks for scalable electronic device fabrication.
The speaker will further introduce the new concept of additive stacking of ultrathin three-dimensional (3D) materials, which has been a missing part to the concept of additive fabrication of electronic materials. The discovery of "remote epitaxy" enables the fabrication of free-standing ultrathin 3D materials as the building blocks for functional stacking. Leveraging the past 50 years of development in conventional 3D materials, 3D material stacking allows immense freedom in electronic design, enabling enhanced device performance and new device architectures.
These two discoveries further allow the integration of 2D and 3D materials as a new research area, which will allow the discovery of new physical phenomena, and lead to the advancements in wearables, human/machine interface, renewable energy, integrated photonics and quantum computation.
Biography: Wei Kong is a postdoc researcher at MIT, specializing in multifunctional integration of ultrathin film 2D and 3D materials, including graphene, hBN, TMDCs, and III-V, III-nitride and oxide compound semiconductors. His interests are in material innovation for human/machine interfaces, renewable energy, wearable electronics, integrated photonics and quantum computation. He obtained his B.S. in Physics from Sun Yat-Sen University, M.S. and PhD. in ECE from Duke University working with Prof. April Brown. He is currently a Shell Energy fellow at MIT, working with Prof. Jeehwan Kim in the Department of Mechanical Engineering, where he is also associated with Research Laboratory of Electronics (RLE). His works have been published in Nature, Science, Nature Materials, and Nature Electronics.
Location: Hughes Aircraft Electrical Engineering Center (EEB) - 248
Audiences: Everyone Is Invited
Contact: Marilyn Poplawski