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Events for March 22, 2010

  • Meet USC: Admission Presentation, Campus Tour, & Engineering Talk

    Mon, Mar 22, 2010

    Viterbi School of Engineering Undergraduate Admission

    University Calendar


    This half day program is designed for prospective freshmen and family members. Meet USC includes an information session on the University and the Admission process; a student led walking tour of campus and a meeting with us in the Viterbi School. Meet USC is designed to answer all of your questions about USC, the application process and financial aid.Reservations are required for Meet USC. This program occurs twice, once at 9:00 a.m. and again at 1:00 p.m. Please visit http://www.usc.edu/admission/undergraduate/visit/meet_usc.html to check availability and make an appointment. Be sure to list an Engineering major as your "intended major" on the webform!

    Location: USC Admission Center

    Audiences: Prospective Freshmen and Family Members - RESERVATIONS REQUIRED

    Contact: Admission Intern

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  • Blood Drive

    Mon, Mar 22, 2010 @ 10:00 AM - 06:00 PM

    Viterbi School of Engineering Student Affairs

    Student Activity


    To Make an Appointment
    Contact: David De Leonardis
    uscblood@usc.edu
    818.728.8866Before Donating
    1) Be in good health
    2) Bring a valid photo I.D.
    3) At least 17 years old
    4) Weigh at least 110 lbs.
    5) Eat a nutritious meal
    6) Drink plenty of water
    7) No tattoos within the
    last 12 monthsBlood Donations Benefit Patients at
    USC University Hospital &
    USC Norris Cancer Hospital.Sponsored by the USC Blood Donor Center

    Location: E-Quad - Between Olin & Hedco

    Audiences: Everyone Is Invited

    Contact: VSoE

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  • A Process Variation Perspective on 3D Integration

    Mon, Mar 22, 2010 @ 10:45 AM - 12:00 PM

    Ming Hsieh Department of Electrical and Computer Engineering

    Conferences, Lectures, & Seminars


    Siddharth Garg,
    Carnegie-Mellon UniversityAbstract:
    3D integration is a promising emerging technology that offers increased system integration by vertically integrating multiple planar die. In addition, 3D integration provides lower communication latency and greater bandwidth between system components, potentially addressing the increased on-chip communication costs that accompany technology scaling. However, emerging technologies must also be critically evaluated to identify potential pitfalls. From this perspective, the elevated thermal profile of 3D integrated circuits (ICs) has already been identified as a cause for concern. In this talk, I will demonstrate that the impact of manufacturing process variations on the performance of 3D circuits is another emerging cause for concern and discuss promising solutions to this problem.I will begin by presenting 3D-GCP, a high-level model for the impact of process variations on 3D IC performance. Using this model I will show that, in fact, 3D ICs suffer greater performance degradation under the impact of process variations compared to equivalent 2D implementations.
    Furthermore, the performance hit is more severe as the number of layers in the 3D stack is increased, potentially eliminating any of performance benefits of 3D integration. Motivated by these predictions, I will present a novel process variation aware 3D assembly strategy that uses post-fabrication test data to maximize the number of assembled systems that meet a specified performance target. Experimental results on both application-specific and general purpose multi-core platforms demonstrate that significant performance yield improvements are achieved using the proposed techniques.Biography:
    Siddharth Garg is currently a post-doctoral fellow in the Electrical and Computer Engineering Department at Carnegie-Mellon University. He received in a Ph.D. in Electrical and Computer Engineering also from CMU, a Masters degree in Electrical Engineering from Stanford University and a Bachelors degree in Electrical Engineering from the Indian Institute of Technology
    (IIT) Madras. In the summer of 2007, he interned at the AMD micro-architecture power and performance modeling group.
    His research interests include design methodologies and tools for reliability and energy-aware multi-processor architectures and 3D integration technology. He has won a best paper at the ISQED
    2009 and the SRC TECHCON 2009, and a best paper award nomination at DATE 2009.

    Location: Hughes Aircraft Electrical Engineering Center (EEB) - -248

    Audiences: Everyone Is Invited

    Contact: Estela Lopez

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  • Challenge to Seeing Atomic Structures of Nano-materials with Electron Microscopy

    Mon, Mar 22, 2010 @ 11:00 AM

    Mork Family Department of Chemical Engineering and Materials Science

    Conferences, Lectures, & Seminars


    Challenge to Seeing Atomic Structures of Nano-materials with Electron MicroscopyProfessor Sumio Iijima
    Meijo University
    Nagoya, Japan Abstract
    Nanoscience deals with nano-scale structures of materials and therefore controlling the structures is crucial. A typical example of nanostructures is carbon nanotubes and their many unique properties have been investigated theoretically and experimentally, and brought a new concept of materials into condensed matter physics. More importantly, nanoscience is closely related to nanotechnology and thus to industrial applications as we see in many fields of carbon nanotube research. An important issue for nanoscience is characterization of materials. In the case of carbon nanotubes their exact atomic structures are determined by means of electron microscopy, Raman and photoluminescence spectroscopy, etc., where sometimes commercially available instruments are not sufficient and need substantial modification for each particular purpose, where “do it yourselfâ€Â becomes important. We demonstrate some latest results on structural characterization of carbon nanotubes, graphene, and boron nitride thin films, including “monatomic carbon strings that have been successfully observed in our laboratory. BiographySumio Iijima is a Professor at Meijo University, a Director of the Nano-tube Research Center at AIST and a Senior Research Fellow at NEC, in Japan. After graduating from Tohoku University, he joined Arizona State University where he developed high-resolution transmission electron microscopy (HRTEM) (1970-1982). In 1982 he returned to Japan and joined the NEC Research Laboratories in 1987. In 1991 he discovered carbon nanotubes that have initiated nano-material science and nanotechnology. Professor Iijima has received numerous honors and awards from Italy, Japan, Spain and Switzerland. He is a foreign associate of the National Academy of Science (USA).Time and Location
    Monday, March 22, 2010Seminar at 11:00 a.m.
    Ethel Percy Andrus Gerontology Center (GER) Auditorium
    A reception will follow in the HEDCO Foundation Building (HED) lobby.

    Location: Ethel Percy Andrus Gerontology Center (GER) Auditorium

    Audiences: Everyone Is Invited

    Contact: Petra Pearce Sapir

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  • BME 533 Seminar

    Mon, Mar 22, 2010 @ 12:30 PM - 01:50 PM

    Alfred E. Mann Department of Biomedical Engineering

    Conferences, Lectures, & Seminars


    Reza Motaghian, Ph.D., Research Faculty/Senior Research Fellow, California Institute of Technology: "Clinical applications of swept laser source optical coherence tomography (SS-OCT)"

    Location: Olin Hall of Engineering (OHE) - 132

    Audiences: Graduate//Department Only

    Contact: Mischalgrace Diasanta

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